Odisha kicks off India’s 1st 3D chip packaging plant
Indian Express·1h ago·Positivity
What Happened
Odisha inaugurated India's first advanced 3D chip packaging unit in Bhubaneswar, implemented by US-based 3D Glass Solutions Inc. The Rs 1,934 crore project, funded by Intel, will produce 70,000 glass panels annually and generate approximately 2,500 jobs, strengthening India's semiconductor manufacturing capabilities.
Key Entities
Odisha3D Glass Solutions IncIntelMohan Charan MajhiAshwini VaishnawBhubaneswarIndia Semiconductor Mission